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%0 Conference Paper %A A. Mallik %A A. Vandooren %A L. Witters %A A. Walke %A J. Franco %A Y. Sherazi %A P. Weckx %A D. Yakimets %A M. Bardon %A B. Parvais %A P. Debacker %A B. W. Ku %A A. Mocuta %A D. Mocuta %A N. Collaert %A P. Raghavan %T The impact of sequential-3D integration on semiconductor scaling roadmap %B 63rd IEEE International Electron Devices Meeting, IEDM 2017 %I Institute of Electrical and Electronics Engineers Inc %8 Jan. 2018
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