%0 Conference Paper %A L. Sheng %A C. De Tandt %A W. Ranson %A R. Vounckx %T Reliability Characterization of Thermal Micro-structures Implemented on 0.8 µm CMOS Chips %B International Reliability Physics Symposium. IRPS 2000 %I International Reliability Physics Symposium. IRPS 2000, Vol. 38, pp. 112-117, San Jose, USA %8 2000 %P 1
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