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@InProceedings{Pub_9855, author = {A. Mallik, A. Vandooren, L. Witters, A. Walke, J. Franco, Y. Sherazi, P. Weckx, D. Yakimets, M. Bardon, B. Parvais, P. Debacker, B. W. Ku, A. Mocuta, D. Mocuta, N. Collaert and P. Raghavan}, title={The impact of sequential-3D integration on semiconductor scaling roadmap}, booktitle = {63rd IEEE International Electron Devices Meeting, IEDM 2017}, publisher = {Institute of Electrical and Electronics Engineers Inc}, month={Jan}, year={2018} }
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