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@InProceedings{Pub_7691, author = {W. Pan, C. De Tandt, F. Devisch, R. Vounckx and M. Kuijk}, title={Half-conductive Coupling for Chip-to-Chip Connections}, booktitle = {IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP}, publisher = {IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP, Vol. 1, pp. 29-32, San Diego, USA}, year={1999}, pages={1} }
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