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Half-conductive Coupling for Chip-to-Chip Connections Host Publication: IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP Authors: W. Pan, C. De Tandt, F. Devisch, R. Vounckx and M. Kuijk Publisher: IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP, Vol. 1, pp. 29-32, San Diego, USA Publication Year: 1999 Number of Pages: 1
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