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@InProceedings{Pub_10299, author = {B. Parvais, E. Rosseel, L. Peng, L. Teugels, A. Vandooren, J. Franco, A. Mallik, A. Hikkavyy, N. Rassoul, G. Jamieson, F. Inoue, G. Verbinnen, E. Vecchio, T. Zheng, N. Waldron, J. Boemmels, V. De Heyn, D. Mocuta and N. Collaert}, title={Key challenges and opportunities for 3D sequential integration}, booktitle = {2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018}, publisher = {Institute of Electrical and Electronics Engineers Inc}, month={Feb}, year={2019} }
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