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%0 Conference Paper %A A. Vandooren %A B. Parvais %A A. Walke %A A. Vais %A C. Merckling %A D. Lin %A N. Waldron %A P. Wambacq %A D. Mocuta %A N. Collaert %T 3D technologies for analog/RF applications %B 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017 %I Institute of Electrical and Electronics Engineers Inc %8 Mar. 2018 %P 3
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