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@InProceedings{Pub_9950, author = {A. Vandooren, B. Parvais, A. Walke, A. Vais, C. Merckling, D. Lin, N. Waldron, P. Wambacq, D. Mocuta and N. Collaert}, title={3D technologies for analog/RF applications}, booktitle = {2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017}, publisher = {Institute of Electrical and Electronics Engineers Inc}, month={Mar}, year={2018}, pages={3} }
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