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@InProceedings{Pub_7674, author = {W. Pan, F. Devisch, C. De Tandt, R. Vounckx and M. Kuijk}, title={Half-conductive Coupling for Flip Chip Interconnections}, booktitle = {IEEE International Workshop on Chip-Package Co-Design, CPD 2000}, publisher = {IEEE International Workshop on Chip-Package Co-Design, CPD 2000, pp. 55, ETH Zürich, Zürich, Switzerland}, year={2000} }
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