|
|
W. Pan, F. Devisch, C. De Tandt, R. Vounckx and M. Kuijk, “Half-conductive Coupling for Flip Chip Interconnections,” in IEEE International Workshop on Chip-Package Co-Design, CPD 2000, IEEE International Workshop on Chip-Package Co-Design, CPD 2000, pp. 55, ETH Zürich, Zürich, Switzerland, 2000.
|
|
