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Journal Publication
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%0 Journal Article %A J. Balachandran %A S. Brebels %A G. Carchon %A M. Kuijk %A W. De Raedt %A B. Nauwelaers %A E. Beyne %T Wafer-level package interconnect options %B IEEE Transactions on very large scale integration (VLSI) Systems %V 14 %N 6 %P 654-659 %8 Jun. 2006
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