|
|
|
|
Journal Publication
|
|
|
|
|
|
|
|
|
%0 Journal Article %A F. Devisch %A X. Maillard %A W. Pan %A C. De Tandt %A R. Vounckx %A M. Kuijk %T Half-conductive coupling interconnection technology for digital transmission between CMOS chips %B IEEE Transactions on Advanced Packaging %N 1 %P 97 %8 Feb. 2002
|
|
|
|
|
|
